Automotive IoT Module
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LTE AG35
AG35 is a series of automotive grade LTE category 4 module developed by Quectel. Designed and manufactured according to IATF 16949:2016 quality management system, it is targeted at the IoV (Internet of Vehicles) applications. Adopting the 3GPP Rel. 10 LTE technology, it features maximally 150Mbps downlink and 50Mbps uplink data rates. It provides abundant interfaces for customers to develop applications, and its excellent performance in ESD and EMI protection ensures great robustness in harsh environments.
Key Benefits
Ideal for automotive premarket applications with IATF 16949:2016 requirement
Compliant with automotive quality processes such as APQP, PPAP, etc.
Wide operation temperature range (-40°C to +85°C) meets the demanding requirements for automotive devices
Excellent EMC protection ensures great robustness even in harsh environments
Compact SMT form factor ideal for integration in slim and size-constrained automotive solutions
MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
C-V2X AG15
Quectel AG15 is an automotive grade C-V2X module designed and manufactured according to IATF 16949:2016 standards. It is designed for use in extremely harsh environments and provides superior ESD/EMI protection performance. Through C-V2X PC5 direct communications, AG15 will make traffic smoother and more efficient through paving the way for automated driving and achieving the goal of fully connected traffic.
Key Benefits
C-V2X PC5 Mode 4 direct communications: independent of cellular network & enabling (U)SIM-less operation
Ideal for automotive premarket applications with IATF 16949:2016 requirement
Compliant with automotive quality processes such as APQP, PPAP, etc.
Wide operation temperature range (-40°C to +85°C) meets the demanding requirements for automotive devices
Excellent EMC protection ensures great robustness even in harsh environments
Compact SMT form factor ideal for integration in slim and size-constrained automotive solutions
MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
*문의
TEL. 031-479-1828~9
E-Mail: alex_sung@picoinc.co.kr
- 이전글Smart IoT Module [Smart Module] 23.08.09
- 다음글Short Range Module [WIFI] 23.08.09